![Figure 3 from Palladium deactivation pretreatment process for electroless nickel immersion gold process (ENIG): Elimination of metal plating at non- plated through holes (NPTH) | Semantic Scholar Figure 3 from Palladium deactivation pretreatment process for electroless nickel immersion gold process (ENIG): Elimination of metal plating at non- plated through holes (NPTH) | Semantic Scholar](https://d3i71xaburhd42.cloudfront.net/b486bef797925667f3831ba36cf472b8ee907e6e/3-Figure3-1.png)
Figure 3 from Palladium deactivation pretreatment process for electroless nickel immersion gold process (ENIG): Elimination of metal plating at non- plated through holes (NPTH) | Semantic Scholar
Through hole plating of printed circuit boards using ultrasonically dispersed copper nanoparticles | Emerald Insight
Improved Electroless Copper Coverage at Low Catalyst Concentrations and Reduced Plating Temperatures enabled by Low Frequency Ul
![Figure 1 from Palladium deactivation pretreatment process for electroless nickel immersion gold process (ENIG): Elimination of metal plating at non- plated through holes (NPTH) | Semantic Scholar Figure 1 from Palladium deactivation pretreatment process for electroless nickel immersion gold process (ENIG): Elimination of metal plating at non- plated through holes (NPTH) | Semantic Scholar](https://d3i71xaburhd42.cloudfront.net/b486bef797925667f3831ba36cf472b8ee907e6e/1-Figure1-1.png)